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1. In a vacuum environment, the equipment will automatically vacuum the PCB and place it on the track to ensure that the humidity indicator card remains ≤ 40%.

2. After the BOT surface is completed, it is automatically turned over and sent back to the production line.

1. Strictly abide by the operating specifications and scrapping standards for solder paste, and regularly check.

2. Formulate specifications and standards for steel mesh checking, scrapping and cleaning.

3. Optimize the setting parameters depending on different products, and carry out regular closed-loop checks on printing effect.

1. Set and control the volume, area, height and offset of solder paste to meet all required quality requirements.

2. Detect the type of any defects and prevent leakage of defective products.

3. Count the CPK of solder paste printing process and carry out continuous improvement.

1. Scan code for material loading and enter WMS system for error prevention and control.

2. BOM comparison and physical measurement interact to confirm material accuracy.

3. Confirm correctness of product patch for first and last articles.

4. Management procedures for bulk materials to ensure standardized use.

1. Conduct furnace temperature control of products based on applicable furnace temperature measurement procedures.

2. Select 5 different measuring points based on product characteristics.

3. Control heating and cooling rates.

4. Identify and control the highest temperature and temperature resistance levels of products and devices in early stage evaluation.

5. First article, X-Ray, thrust meter and other equipment are used to assist in welding function confirmation.

1. Identify any defects after solder paste welding (using defect map), and online advanced warning pre-processing production.

2. Control coverage and fault rate of AOI equipment.

3. Designated personnel are assigned to specific posts, with regular GR & R assessment conducted for AOI personnel to prevent leakage.

4. Statistical analysis of SMT first pass rate, optimization and improvement of overall product yield.

1. BOM and SOP guide the accuracy of material structure, location, direction and usage quantity.

2. Confirm both first and last article samples and process inspection to ensure product quality.

3. Control process ESD protection and vehicle cleanliness to ensure standardized process operations.

1. Accurately set preheating temperature and time based on temperature resistance registration of products and components.

2. Control flux flow, chain speed, peak height, mode and welding time depending on specific products.

3. Use a thermometer to carry out actual measurement of furnace temperature parameters (temperature profile).

4. Use first article and X-Ray technology to detect wave soldering quality.

5. Use a third party to test for tin composition of the tin furnace (also Cu content).

6. Control cleaning frequency of tin slag within the tin furnace; (regular 4H cleaning / time).

1. The actual plate surface temperature of the repair welding should be less than 260℃, while the unloaded temperature of the solder tip should be 380±10℃.

2. Drag soldering time of the solder tip in the same position is less than or equal to 3s.

3. Manual welding repair should be visually inspected under a magnifying glass more than 3 times.

1. Identify defects after solder paste welding (using defect map) to promote quality optimization.

2. Control coverage rate and inaccuraciesin AOI equipment.

3. Dedicated personnel are assigned to special posts, with regular GR & R assessment for AOI re-judgment personnel to prevent leakage.

4. Statistical analysis of first pass rate for SMT, to ensure optimization and improvement of overall product yield.

1. Special fixtures are used to detect open circuit, short circuit and welding of all parts of the PCBA.

2. Analyze any instances of poor PCBA functionality caused by different defects, including open circuit, short circuit, missing parts, or wrong materials.

1. A special fixture simulates and detects the operating procedure for the whole machine, identifying any poor functionality.

2. Analysis of unsatisfactory functional performance during simulation, including software error, overload, wiring error, incorrect program burning, or device overload.

1. Process welding and internal structure images of devices that cannot be visually analyzed all undergo X-ray analysis.

2. Analysis of manufacturing process and material quality status, including solder hole rate, penetration height, BGA short circuit, and internal device structure.

1. The common thickness standard for spraying dry film is 30-80um.

2. Wet film spraying is measured using a wet film thickness gauge.

3. The spraying procedure avoids functional devices such as PAD and connectors.

4. The furnace temperature is controlled at 60-100 ° C to prevent defects such as orange peel, bubble and glue flow.

5. Control the standing time after shutdown to avoid finger prints, anti-sticking, wet glue and other defects.

1. Operators at the PCBA inspection station should follow ESD electrostatic protection requirements and keep their eyes 30 cm away from the products to be inspected.

2. For certain components, it is necessary to check the PCBA assembly with an auxiliary amplification device.

3. For example, a microscope with a magnification of not less than 40 times should be used to inspect the 0201 chip component.